Chipmaking equipment giant Applied Materials Inc. is trying to make life easier for its chip fabrication plant customers, so ...

Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chipsA new epitaxy system optimized for DRAM ...

Intel Corp. has shared new information about Intel 14A, an upcoming chip manufacturing process that will use ASML Holding NV’s most advanced lithography machines. Executives detailed the process today ...

TSMC's upcoming CoPoS packaging technology could reduce chip costs while improving AI performance, with mass production ...

Key Points Interested in Intel Corporation? Here are five stocks we like better. The recent leadership overhaul, which carved ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

Use left and right arrow keys to seek audio. NVIDIA's beefed-up B300 AI chip production has been reportedly pulled forward to May, and will be fabbed on TSMC's new 5nm (N4P) process node and will use ...

KLAC's record fiscal Q3 revenues, rising advanced packaging outlook and AI-driven process control demand position it as a key semiconductor winner.

The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging technique, on TSMC's 2nm chip fabrication technology. Rumors about the iPhone 18 ...

Researchers at the National Institute of Standards and Technology (NIST) have developed a new way to package photonic integrated circuits — tiny chips that convey information using light instead of ...

Analyst Ming-Chi Kuo has echoed other reports that Apple is expected to use a new chip packaging technology in the A20 chip, which will debut in the iPhone 18 next year. His report focuses on ...