A new technical paper titled “Ramping Up Open-Source RISC-V Cores: Assessing the Energy Efficiency of Superscalar, ...

Reworking chip grants; global semi, equipment sales up; GF's $16B expansion; Arm's AI-defined vehicles platform; Mexico's ...

Multi-die assemblies enable more analog content, but that adds new security vulnerabilities for which there is little ...

Edge AI, GenAI, and next-gen communications are adding more workloads to phones that are already under pressure to deliver ...

Smart glasses with augmented reality functions look more natural than VR goggles, but today they are heavily reliant on a ...

End-to-end solution that enhances EM analysis, improves co-design efficiency, and accelerates RF integration within ...

Commercialization has started for network switches based on co-packaged optics (CPO), which are capable of routing signals at ...

Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics” was published by ...

A recent technical paper titled “Factors determining bond wave speed in wafer bonding” was published by researcher at ...

PMJ 2025 was more than just a successful event—it was a clear signal that the photomask and eBeam communities are growing, ...

Today, we are witnessing a paradigm shift towards a more modular design approach that disaggregates SoC functions into ...

The researchers used it to map stray magnetic fields from CoFeB–SiO2 thin films used in high-frequency inductors. They ...