The chiplets design combines IP access, interposer expertise, and relationships with HBM suppliers, foundries and OSATs ...

Multi-die design teams should adopt modular principles, utilize proven IP blocks with D2D support, and implement automated integration tools.

Why chiplets and why now? A special section at EDN provides a detailed treatment of this revolutionary silicon technology ...

Baluns enable impedance matching, minimize signal distortion, and suppress common-mode noise in RF and high-frequency designs ...

An archaic DieHard device has seemingly died hard; is hacking it to resurrect a portion of its original function a worthwhile endeavor?

LLC, positioned between external memory and internal subsystems, stores frequently accessed data close to compute resources.

Leveraging ST’s 40-nm process and an Arm Cortex-M33 core, STM32C5 MCUs deliver increased speed for cost-sensitive embedded ...

A DIY PCB fixture using split-Kelvin technique enables accurate, repeatable LCR measurements for low-impedance SMD components ...

A compensated Pt100 RTD circuit has 1 mV/°C DMM output, with linearization via positive feedback, pending Part 2 ...

How different are two generations of smart plugs, and is the recent device’s issue due to hardware, software or a combination ...

A panel of industry experts takes a sneak peek at system-level design challenges in EVs and outlines viable solutions.

Hybrid Voice AI combines on-device reflex processing with cloud reasoning to create reliable, always-available smart home voice control.