Something there is that doesn’t love a wall,” Robert Frost wrote in the famous opening line of his 1914 poem “Mending Wall.” ...

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This is a follow-up to a story that appears in the June 2018 issue of National Geographic magazine. On a fall morning in 1937, an Emory University geologist was walking down a hallway in the alumni ...

Abstract: In this paper, we present thermal dissipation challenges in three dimensional (3D) stacked devices and discuss strategies to tackle these issues through innovations in materials, ...

Abstract: 3D stacked devices without area penalty from device-device space, such as complementary FET (CFET), is promising for post-nanosheet CMOS scaling. New MOL architectures, such as backside ...