The True History of New England’s Stone Walls

Something there is that doesn’t love a wall,” Robert Frost wrote in the famous opening line of his 1914 poem “Mending Wall.” ...
IEEE

Thermal dissipation in stacked devices

Abstract: In this paper, we present thermal dissipation challenges in three dimensional (3D) stacked devices and discuss strategies to tackle these issues through innovations in materials, ...
IEEE

3D Stacked Devices and MOL Innovations for Post-Nanosheet CMOS Scaling

Abstract: 3D stacked devices without area penalty from device-device space, such as complementary FET (CFET), is promising for post-nanosheet CMOS scaling. New MOL architectures, such as backside ...