According to the researchers, the platform can achieve wafer-scale integration of all the devices required to build an ...

Data sharing becomes more challenging when AI and multi-die assemblies are involved.

Note: all measurements made with and without temperature.

Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue ...

TSMC, ASML earnings; 2nm processor; HBM4; touch controllers for foldable OLED displays; $500B AI supercomputer buildout; ...

Semiconductor Engineering has compiled a comprehensive list of the types of packages, what’s included in them, and various ...

Manufacturers are turning to automation, AI, and robotics to boost repeatability, cut costs, and support heterogeneous ...

Publication citation: C. -H. Lai, W. -J. Yin, W. -H. Lai, C. -L. Kao, C. -C. Wang and C. Hung, “Fine-Line RDL Structure ...

Breakthrough approach delivers better scaling and power efficiency, but at the cost of new processes like wafer thinning, ...

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...

The points of the target shape on the right form a circular inner ring, as shown by the blue tracing. If you draw that exact ...

Siemens’ Tova Levy finds that heterogeneous integration necessitates a shift to a system-level technology co-optimization ...