DISCO Technical Review 與Kiru（切）・Kezuru（削）・Migaku（磨）技術相關的見解‧論文之頁面。

DISCO Technical Review 有关 Kiru（切）・Kezuru（削）・Migaku（磨）技术的见解和论文。

DISCO’s current main customers are semiconductor and electrical components manufacturers, who manufacture products at their own factories using DISCO equipment and processing tools …

Dec 10, 2024 · DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) …

DFG8020 In-Feed Surface Grinder Fully AutomaticDFP8140 Polisher Fully Automatic Φ200 mm 1 axis, 1 chuck table

This is an ingot slicing method where a separation layer (KABRA layer) is formed at a specified depth by continuously irradiating an ingot with a laser, producing wafers starting from the KABRA layer. In …

様々なポリッシング手法をラインナップ 採用実績が多いDISCO オリジナルの乾式研磨ドライポリッシュ 清浄性が求められる場合はウェットポリッシング(CMP) より強度を求める場合はドライエッチン …

DISCO Technical Review Kiru（切る）・Kezuru（削る）・Migaku（磨く）技術に関する技術見解・ 論文のページです。

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5. References [1] DISCO Technical Review TR16-05 [2] DISCO Technical Review TR23-03